Beaumont’s Moldflow® Webinar Series

Thank you for being a part of our Moldflow® webinar series! This page is here for you to catch up on any sessions you may have missed or revisit valuable insights, tips, and tricks.

If you are interested in more content like this, please consider registering for our upcoming Beaumont Moldflow User Group Meeting!: Our free, in-person conference designed for Autodesk Moldflow users and plastics professionals. Discover real-world case studies, expert workflows, and the latest simulation tips—plus opportunities to network and help advance software solutions across the industry. Lunch and refreshments provided.

Expedite Analysis Setup – Cool + Fill + Pack + Warp

Presented by: Eric Madler – Design & Simulation Engineer, Beaumont

As an analyst it is important to provide results and recommendations to our customers in a timely and accurate manner.
In our first webinar, Eric showcases tips and tricks for expediting set up times by utilizing some built-in features within Moldflow you may not be aware of.

Thermal Pins – How to Model and Why it Matters

Presented by: Michael Hall – Design & Simulation Engineer, Beaumont

Thermal Pins are used in place of or in addition to baffles and bubblers to improve heat extraction from hot spot regions in injection molded parts. The evolution of injection molding flow simulation allows us to evaluate cooling lines within a mold before cutting steel, but can thermal pins be accurately modeled within the simulation? Proper modeling techniques are essential to differentiate between using a bubbler, baffle, or thermal pin in Moldflow to minimize hot spots across the cavity and avoid costly tool revisions.

Hot Gate Insulation – Is the Default Assumption Safe?

Presented by: Jerry Rooney – Design & Simulation Engineer, Beaumont

By default, Moldflow assumes good insulation between Hot Gate elements and part elements. Consequently, the mold temperature near the gate is quite uniform, and shows little evidence of the heat load from the nearby hot gate. But is this default assumption safe? Jerry Rooney provides in-depth information on how Moldflow’s hot gate insulation defaults affect the packing and warpage of injection-molded parts.

STAMP – Shrinkage Test Adjusted Mechanical Properties

Presented by: Dave Corsi – Design & Simulation Engineering Manager, Beaumont

An accurate simulation is only as accurate as the information provided. One of the most important inputs in plastic flow simulation is the material file itself. If a material file is missing critical tested data, then the simulated results could be compromised. Simulation software generally uses a simplified thermo-viscous-elastic residual stress model due to the lack of good material data in anisotropic thermo-viscoelastic residual stress calculations and crystallization. This model has a constant solidification temperature with available material data obtained under laboratory conditions. It can generally provide acceptable results helping users optimize the processing conditions for mold and part design. However, model calibration and correction can further improve the predicted accuracy. Moldflow uses measured shrinkage data to improve the shrinkage and warpage prediction for Midplane and Dual Domain models known as CRIMS “Corrected Residual In-Mold Stress”. STAMP or “Shrinkage Test Adjusted Mechanical Properties” is a shrinkage correction model that will use the measured shrinkage data, obtained from rectangular plaque moldings, to calibrate modulus, Poisson’s Ratio, and Coefficient of Thermal Expansion (CTE). This new model gives additional accuracy for 3D simulations and is only available for Autodesk Moldflow.


Hear what attendees are saying!

“Beaumont’s Moldflow Webinar Series is a direct testament to their real-world expertise. Their hands-on approach allows for seemingly small details that truly resonate with users, providing immediate insights. A great example of this occurred during Jerry Rooney’s presentation. His demonstration fundamentally changed how I now approach that particular design of hot runners.

Beyond hosting these industry-unique webinars for customers, Beaumont’s Moldflow Support program is fantastic. It’s reassuring to know they have an experienced and dedicated engineering team that stands firmly behind their software. For anyone considering Moldflow, Beaumont’s expertise and crucial support system make them an invaluable partner.”